Materials and Components – Element Evaluation

• Active Elements (every wafer lot)
  • 100% high magnification visual
  • 100% probe at room temperature
  • Samples assembled and put through standard environmental screening, including burn-in and electrical at min, max, and room temperature
  • Life Test
  • Scanning electron microscope (SEM)
  • Wire bond pull
• Passive Elements (capacitors, resistors, inductors - per component manufacturing lot)
  • 100% visual
  • 100% electrical on select parameters at room temperature
  • Sample assembled and screened, including voltage conditioning and full electrical at room temperature
  • Wire bond pull
• Hybrid Microcircuit 100% Testing
• Non-destructive bond pull
• Internal visual inspection
• Temperature cycling 10 times from -65°C to +150°C
• Constant acceleration 3,000 G
• PIND 1% PDA on 5th run and under 25% total
• Burn-in 320 hours at +125°C, PDA 2% second half of burn in/ Burn-in 160 hours at +125°C, PDA 10%
• Seal (fine and gross)
• Full electrical test at min, max, and room temperature
• Radiography
• External visual
• Material Control
• Full lot traceability to individual wafer
• Lot homogeneity