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Overview

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World Class Circuit Card Assemblies 

DDC’s board manufacturing capabilities include assembling per IPC-A-610 Class 3, completing 100% AOI (Automated Optical Inspection), and the capability for both surface mount and through-hole. 

Modified Standard Solutions

Using DDC’s advanced standard designs, we can easily make modifications to custom fit your individual needs.

Complete Custom Solutions 

Partnering with DDC at the beginning of your design, we will work together to design the optimal circuit card assembly or complete Line Replaceable Unit (LRU) for your applications.

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Building Blocks

Achieve your ideal solution using field proven customizable building blocks from the world leader in high-reliability data communications and control technology:  IP, Components, Boards, and Software.

Applications

Technologies

  • AFDX®/ARINC 664
  • ARINC 429/615/629/717
  • Ethernet
  • Fibre Channel
  • High-Speed 1760/FC-AE-1553
  • Hyper 1553
  • MIL-STD-1553 A/B
  • MIL-STD-1760
  • MMSI/EBR-1553
  • Motor Drives
  • Solid-State Power Controllers
  • Synchro/Resolver Conversion

Form Factors

  • AMC
  • cPCI/PXI
  • ExpressCard
  • Mini-PCIe
  • PC/104-Plus , PCI-104
  • PCI/ PCI-Express
  • PCMCIA
  • PMC/XMC
  • Small Form Factors
  • USB
  • VME/VXI

Hardware Capabilities

  • Analog Design
  • ASIC/FPGA/IP
  • Board Level Design
  • Line Replaceable Boxes
  • High-Speed Layout
  • Ceramic Hybrids
  • Magnetics/Transformers
  • Mechanical Design
  • Miniaturization
  • Multi-Chip Modules
  • Ruggedization
  • Thermal Management

I/O

  • ARINC 429/615/629/717
  • Avionics I/O
  • CANbus 2.0
  • IRIG-106 Chapter 10
  • IRIG-B
  • MIL-STD-1553
  • RS-232
  • RS-422/485

Software Capabilities

  • Windows®
  • Linux®
  • VxWorks®
  • Integrity®
  • GUIs
  • LabVIEW®/LabVIEW Real-Time
  • LabWindows®
  • LynxOS®

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The DDC Advantage

DDC designs, manufactures, assembles, and tests all products to the highest standards, ensuring your solution works optimally and reliably, outperforming any alternative.

Ruggedization

DDC designs boards, hybrids, and multi-chip modules (MCM) to meet ruggedness and reliability levels for performance in demanding environments:

  • Flyable Boards for Conduction or Air-Cooled Applications
  • Extended Temperature Operation
  • Conformal Coating Available
  • MIL-STD-810/VITA 47 Shock and Vibration

Miniaturization

Reduce size, weight, and power (SWaP) with DDC’s multi-channel, multi-I/O, and MCMs.

  • High Channel Count
  • Multiple I/Os or Protocols on a Single Board
  • Small Form Factors
  • Small Integrated MCM/Hybrids

Integration

DDC designs integrated hybrids and multi-chip modules to include protocol, processing, memory, transceivers, and magnetics into small rugged single component solutions.

  • Ceramic/Hermetic Hybrids
  • Plastic Encapsulated Multi-Chip Modules
  • Integrated Protocol, Memory, PHY, Magnetics

Life Cycle

With close to 50 years of experience, DDC understands the life cycle requirements of the military and aerospace industries. With a comprehensive system to manage obsolete materials, we are committed to supplying electronic products that ensure:

  • Uninterrupted product availability
  • Backwards hardware and software compatibility
  • Configuration control

Complete Support...From Concept to Completion

  • Hardware Design
  • Software Design
  • Thermal and Mechanical
  • Analysis
  • Program Management
  • Manufacturing and Testing
  • Qualification and Validation
  • Documentation
  • Product Support