Volume 7, Issue 4                                                                                     December 2013
2013 has been a very exciting year for DDC...we expanded our data bus and networking product portfolio with the acquisition of National Hybrid's (NHI) data bus product line, and we introduced several upgrade enabling product solutions, including: a smart data networking protocol bridge, a flight optimized PDU, a field replaceable SSPC LRM, and a high-performance 3-phase BLDC motor controller.

We look forward to building upon our 2013 achievements to make 2014 an even more beneficial year for our customers. We wish you a wonderful holiday season and a prosperous new year!
 New Products
 AFDX®/ARINC 664 Part 7 Switches!
AFDX Switches DD-82501W &
DD-82502W
Released: Dec 10, 2013
  Save Test & Integration Time with AFDX®/ARINC 664 Switches & PMC Interface Card!
DDC introduces AFDX®/ARINC 664 Switches, in lab and rugged versions, to complement its AFDX®/ARINC 664 PMC Interface Card. The switches provide a complete solution for all network and/or end system test and integration tasks-saving development, validation and integration costs.
Feature
DDC's AFDX®
COTS
Ethernet Switches
 Full AFDX® Compliance Yes No
 Easy to Configure Yes No
 Integrated Traffic Echoing Yes Difficult to Configure
 Automated Workflow
 Integration
Yes No
 Error & Health Monitoring Yes No
AFDX®/ARINC 664 Switches
Press Release
 Multi-Channel MIL-STD-1553 XMC Cards!
XMC Card BU-67112
Released: Dec 10, 2013
  Save Space, Power, Weight and Cost with High Channel Count XMC Cards!

DDC expands its MIL-STD-1553 XMC card offering to now include front and rear I/O options, along with air and conduction cooled configurations, to support a wide range of embedded applications.

  • Rugged XMC Design for Harsh Environments
  • High Channel Count Saves Space, Power, Weight & Cost
  • IRIG 106 Chapter 10 and Tx Inhibit Ideal for Flight Data Recorders
  • On Board DMA Engine Reduces Host CPU Utilization

MIL-STD-1553 XMC Cards

 World's Most Compact, Fully Integrated MIL-STD-1553 BGA Package!
Total-AceXtreme BU-67301B0T0X
Released: Dec 3, 2013
  Total-AceXtreme®...now Full Mil-Temp!

DDC introduces a full military temperature (-55°C to +125°C) version of the Total-AceXtreme-the world's smallest, ultra-low power, fully integrated MIL-STD-1553 BGA package, complete with 1553 protocol, 2 Mb RAM, transceivers and isolation transformers inside a single package.

  • Ultra Small Size Saves Space
  • Development Kit for Easy Integration
  • UItra Low Power Consumption Creates Less Heat
  • Replaces 2 Transceivers, 2 Transformers, MIL-STD-1553 Protocol Core and Memory
  • Single Package Simplifies Layout

Total-AceXtreme

 Announcements
 FREE 2014 Calendar...While Supplies Last!
Calendar   DDC's 50th Anniversary Wall Calendar!

To kick-off the celebration of our 50th anniversary in 2014, DDC is offering free wall calendars for the first 50 respondents to this limited offer. (Limit one offer per respondent.)


Request Calendar

 DDC Values Your Opinion!
Anniversary   Win one of three $50 American Express Gift Cards to celebrate DDC's 50th Anniversary!

DDC turns 50 next month, and to ensure we effectively communicate new product solutions and news to you in 2014, we ask for your input through a brief 5 question survey. Additionally, to celebrate our 50th anniversary, three entries will be selected at random to win a $50 American Express gift card.

Take the Survey

Share Your History & Experiences with DDC!

We would like to hear about your history and experiences with DDC. Selected entries will be published on our website! Please submit text, photos, and/or videos you would like to share of your experience with DDC to info@ddc-web.com.


Note: By submitting these items you are granting your approval to publish these items electronically or in print and that there are no known copyright or privacy issues that would prevent them from being published.

 Press Releases & Articles
 Press Releases
PCIe Total-AceXtreme   World's 1st PCI-Express to MIL-STD-1553 BGA Package Saves Space and Power!

Simplify MIL-STD-1553 board design and layout!
- Released July 30, 2013

More Info
Compact Power Controller   Compact Power Controllers Save Weight, Space, and Enable Smart Power Management!

Light and compact power distribution unit for unmanned aircraft applications!
- Released July 24, 2013

More Info
LRM Power Controller   LRM Power Controllers Enable Fast Field Replacement and Smart Power Management!

Multi-channel solid-state power controller in line replaceable module format supports two-level maintenance!
- Released July 24, 2013

More Info
3-Phase BLDC Motor Torque Controller   High Performance 3-Phase BLDC Motor Torque Controller!

Highly linear current control and superior holding torque, in a low cost modular package!
- Released July 22, 2013

More Info
 Tradeshows & Events
 Upcoming Tradeshows
IRSI 2013   IRSI 2013

December 10 - 14, 2013
International Radar Symposium India 2013
Bangalore, India
Booth C25

Invitation
Request a Booth Meeting 
 Recently Attended Shows
IRSI 2013   Armoured Vehicles Asia

October 30-31, 2013
Singapore

View Photos from Event

The 26th Microelectronics Workshop - JAXA Japan

October 24-25, 2013
(Epochal Tsukuba) in Japan

View Photos from Event

AUSA 2013 Annual Meeting & Exposition

October 21-23, 2013
Washington D.C.

View Photos from Event

Motion Control 2013

October 15-17, 2013
Los Angeles, California

View Photos from Event

DSEI 2013

September 10-13, 2013
ExCel, London

View Photos from Event

AUVSI 2013

August 12-15, 2013
Washington D.C.

View Photos from Event


Data Device Corporation (DDC) is the world leader in the design and manufacture of high-reliability data bus, motion control, and solid-state power controller products for aerospace, defense, and industrial applications. For nearly 50 years, DDC has continuously advanced the state of high-reliability data networking and control technology for MIL-STD-1553, ARINC 429, Fibre Channel, Ethernet, Synchro/Resolver interface, Motor Controllers/Drives, and Solid-State Power Controllers with innovations that have minimized component size and weight while increasing performance.


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